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Rhim, J.W., Lee , Hong, S.I., and Ha, C.S. (2009). Tensile, water vapor barrier and antimicrobial properties of
PLA/nanoclay composite film,
Packag. Technol. Sci.
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The 2006
International Conference on Nanotechnology for the Forest Products Industry,
April 26-28, 2006,
Atlanta Marriott Marquis, Georgia, USA.
