158
Abstract
Since the contamination of lead in food has become a serious concern, replacing the use of Sn-Pb solders
in food container by lead-free solder is an effort to reduce the toxic substance. In this paper, a feasibility study on
soldering process of Sn-0.7Cu lead-free solder and AISI 304 stainless steel was performed. Optimization of
soldering process parameters was achieved to maximize the shear strength of lap joint of AISI 304 stainless steel
soldered by Sn-0.7Cu. Taguchi method was used to find the optimal level of soldering parameters. Three soldering
parameters were investigated in this study including overlap length, surface roughness of the stainless steel sheet,
and joint clearance. The response of this study was shear strength of the lap joint. Results showed that setting the
overlap length of 4 mm, the surface roughness of 600 grits, and the joint clearance of 0.4 mm provides the
maximum shear strength of 47.28 MPa which is greater than the shear strength of the traditional Sn-Pb solder of
39.16 MPa. However, soldering using Sn-0.7Cu lead-free solder has a higher production cost than the soldering
process employing the traditional Sn-Pb solder.
Keywords
: Soldering, Lead-free solder, Stainless steel
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